Publication
Mechanistic studies of silicon wafer bonding and layer exfoliation
M.K. Weldon (1), V.E. Marsico (1), Y.J. Chabal (1), A. Agarwal, D.J. Eaglesham, J. Sapjeta, W.L. Brown,
D.C. Jacobson (1), Y. Caudano (1, 2), S.B. Christman (1) and E.E. Chaban (1)
Proc. Fourth Int. Symp. On Semiconductor Wafer Bonding : Science, Technology and Applications, vol 97-36
(Electrochemical Society, Pennington, NJ, 1998) p. 229
Abstract
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Author addresses
Please, note that this list is currently incomplete.
- Bell Laboratories - Lucent Technologies
600 Mountain Avenue, Murray Hill, NJ 07974, USA - Laboratoire de Spectroscopie Moléculaire de Surface (LASMOS)
Institute for Studies in Interface Science (ISIS)
Facultés Universitaires Notre-Dame de la Paix (FUNDP)
61 Rue de Bruxelles, B-5000 Namur, Belgium
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